Company

Taiwan Semiconductor Manufacturing Company Limited

Location

Taiwan

Career Area

IC Design Technology

Job Type

Engineer / Admin

Employment Type

Regular

Posted

Jul 31, 2026

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Bachelor's, Master's or Ph.D. students graduating in 2027 or candidates who can join by end of 2027.

Job Responsibilities

At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers.

Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area.

Physical Designer

The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements.

Standard Cell Engineer

1. Pathfinding of library characterization for leading edge tech nodes.

2. Support industrial standard library kits generation and QC.

3. In-house library generation flow and/or utility development.

4. RC parasitic extraction analysis and APR related analysis.

Layout Engineer

1. IC layout for advanced technology (Std. cell/Memory/AMS/IO).

2. Layout structure development for new technology.

3. Pathfinding for new technology development.

4. Customer engagement and layout support.

5. Design and technology co-optimization (DTCO).

6. AI and automation for layout and physical design.

System and Chip Design Solutions Development

Please refer to the Link

FE design & DF

1. Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG).

2. Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc.

3. Technology benchmarking for PPA evaluation of the advanced nodes.

4. DTCO (Design & Technology Co-Optimization) pathfinding and development.

SRAM Engineer

1. SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications.

2. RRAM/MRAM, emerging memory development.

3. In memory computing research and development.

Design Flow/Methodology

1. Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support.

2. Advanced technology design development flow development and technical support.

3. Automation program development to support design kits and flow development. productivity/quality.

Job Qualifications

1. Master's degree in Electrical Engineering or Computer Engineering.

2. Strong proficiency in speaking and writing English.

3. Thorough understanding of place and route flow.

4. Excellent interpersonal and communication skills.

5. Self-motivated and possess excellent team spirit.

TSMC Core Values

At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work:

Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.
Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees.
Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice.
Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term.

(For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values)

Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

[2026 TSMC US Fall Campus Recruitment] Design and Technology Platform Engineer (DTP)

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